Doctech HK LTd
Key Responsibilities:
Lead the research and development of electroplating solutions for surface metal treatments, focusing on advanced additive formulations.
Conduct in-depth material characterization and performance analysis of electroplated metals and coatings.
Collaborate with the R&D team to innovate and optimize formulations to enhance metal deposition quality, conductivity, and stability.
Design and execute experiments to test electrochemical properties and develop novel methodologies for improved metal adhesion and corrosion resistance.
Provide technical guidance and support for scale-up processes from laboratory to production.
Qualifications:
Major in Chemistry, Material Science, or a related field.
Proven experience in electrochemistry, particularly in the development of electroplating solutions.
Expertise in materials analysis techniques and other related testing methodologies will be a PLUS.
Strong laboratory skills, with experience in metal deposition and surface treatment technologies.
Ability to thrive in a collaborative, fast-paced environment while managing multiple research projects.
On-Site Application at Career Fair