Our research team aims to develope new materials based on a newly developed nano-twin copper (nt-Cu) electroplating material for advanced electronics applications. In copper electroplating, controlling the additive formula and content to obtain a suitable grain structure is the key for redistribution layers (RDLs), Cu interconnects and micro-pillar technologies, which are ideally suited for high density requirements. In other words, a different layout is required to meet next-generation IC chip requirements.

We focus on the development and commercialisation of nt-Cu as a promising nanomaterial in the above relevant areas for consumer electronics, which requires copper to be of optimum uniformity, high purity and reliability, with superior via-filling, along with low manufacturing cost.

Our goal is to innovate scalable and novel nt-Cu for constructing key devices with the features of low-power consumption and transferability; and to provide solutions and platform technologies to fulfill the requirements of our clients. The nt-Cu material is formulated to enhance the reliability of fine-line RDL and improve via-filling performance. The hybrid copper structure also provides promising Cu-Cu bonding technology.