Prof. King-Ning TU
Professor TU King-Ning is the Chair Professor of Materials and Electrical Engineering of the City University of Hong Kong. Professor Tu received his BSc degree from National Taiwan University, MSc degree from Brown University, and PhD degree on applied physics from Harvard University in 1968. Professor Tu has been the TSMC Chair Professor and E. Sun Scholar of National Chiao Tung University, Taiwan. Professor Tu is a world leader in the science of thin films, especially in its applications in microelectronic devices, packaging and reliability. His recent work is on predicting failure in modern microelectronics based on entropy production.
Research Expertise
• Thin Film Materials Science
• Kinetics in Nanoscale Materials
• Reliability Science in Microelectronic Devices
Professional Experience
| 04/19 – 03/22 | E. Sun Scholar at National Chiao Tung University, sponsored by Ministry of Education, Taiwan |
| 07/16 – Now | TSMC Chair Professor, National Chiao Tung Uni., Hsinchu, Taiwan |
| 07/98 – 06/04 | Chair, Dept. of Materials Science & Engineering, UCLA |
| 07/93 – 06/16 | Professor, Dept. of Materials Science & Engineering and Dept. of Electrical Engineering, UCLA |
| 09/02 – 10/02 | Tan Kah Kee visiting professorship in School of Materials Engineering, Nanyang Technology University, Singapore |
| 07/88 – 06/93 | Adjunct Professor, Dept. of Materials Science, Cornell University, Ithaca |
| 12/68 – 06/93 | IBM T.J. Watson Research Center, Yorktown Heights, New York 09/85 – 10/87: 3rd Level Manager of Materials Science Department 09/78 – 08/85: 2nd Level Manager of Thin Film Science Department 09/72 – 08/78: 1st Level manager of Kinetics and Diffusion Group |
Honors
• IEEE Division of Components, Packaging, and Manufacturing Technology Award, 2017"Materials Research Society - Fellow, 2014
• TMS John Bardeen Award, 2011
• TMS-EMPM Division Distinguished Scientist/Engineer Award, 2006
• Member of Academia Sinica, ROC, 2002
• Humboldt Research Award for Senior US scientists, 1996
• Acta/Scripta Metallurgical Lecturer, 1990 - 1992
• Churchill College - Overseas Fellow, 1990
• The Metallurgical Society - Fellow, 1988
• Materials Research Society - President, 1981
• The Metallurgical Society - Application to Practice Award, 1981
• American Physical Society - Fellow, 1981
Selected Publications from >500 Publications
(citation over >28,000, h-index: 89)
• Authored a reference book on “Understanding the reliability technology based on entropy production, and other researches” to be published by Index of Science, UK, in 2021.
• Co-authored with Prof. Hung-Ming Chen and Prof. Chih Chen a textbook on “Electronic Packaging Science and Engineering” to be published by Wiley in 2021.
• Co-authored with Prof. A. M. Gusak a textbook on “Kinetics in Nanoscale Materials”, published by Wiley in 2014
• Published a textbook on “Electronic Thin Film Reliability” by Cambridge University Press in 2011, which has been translated into Korean in 2016 (ISBN 978-89-6421-277-6)
• Published a reference book on “Solder Joint Technology” which was published by Spring in 2007
• Co-authored (with J. W. Mayer and L. C. Feldman) a textbook on “Electronic Thin Film Science,” published by Macmillan in 1992
- Tu, K. N., & Gusak, A. M. (2019). A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy production. Journal of Applied Physics, 126(7), 075109.
- Tu, K. N., Liu, Y., & Li, M. (2017). Effect of Joule heating and current crowding on electromigration in mobile technology. Applied Physics Reviews, 4(1), 011101.
- Hsiao, H. Y., Liu, C. M., Lin, H. W., Liu, T. C., Lu, C. L., Huang, Y. S., Chen, C., & Tu, K. N. (2012). Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper. Science, 336(6084), 1007–1010.
- Chen, K. C., Wu, W. W., Liao, C. N., Chen, L. J., & Tu, K. N. (2008). Observation of Atomic Diffusion at Twin-Modified Grain Boundaries in Copper. Science, 321(5892), 1066–1069.
- Tu, K. N. (2003). Recent advances on electromigration in very-large-scale-integration of interconnects. Journal of Applied Physics, 94(9), 5451–5473.
- Tu, K. N. (1994). Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions. Physical Review B, 49(3), 2030–2034.
- Gösele, U., & Tu, K. N. (1982). Growth kinetics of planar binary diffusion couples: ’’Thin‐film case’’ versus ’’bulk cases’’. Journal of Applied Physics, 53(4), 3252–3260.
- Poate, J. M., Tu, K. N., & Mayer, J. W. (1978). Thin Films: Interdiffusion and Reactions (Electrochemical Society). Wiley.
- Mayer, J. W., Poate, J. M., & Tu, K. N. (1975). Thin Films and Solid-Phase Reactions. Science, 190(4211), 228–234.
- Tu, K. N., & Turnbull, D. (1967). Morphology of cellular precipitation of tin from lead-tin bicrystals-II. Acta Metallurgica, 15(8), 1317-1323.