Advanced Matter and Materials
Program
| Day 1: 19 September 2022 (Monday) | |
|---|---|
| 09:00 - 09:10 | Opening Ceremony |
| 09:10 - 10:00 | Featured Speaker
Prof. Ke Lu, Chinese Academy of Sciences The Schwarz Crystal Structure: A Metastable Structure in Polycrystalline Metals with Extremely Fine Grains |
| 10:00 - 10:30 | Invited Speaker
Prof. Nikolaus Osterrieder, City University of Hong Kong Vaccine or Treatment: No Entry of SARS-CoV-2 is the Goal |
| 10:30 - 11:00 | Break |
| 11:00 - 11:30 | Invited Speaker
Prof. Lit Man Leo Poon, The University of Hong Kong Stability of SARS-CoV-2 in Different Environmental Conditions |
| 11:30 - 12:00 | Invited Speaker
Dr. Ruquan Ye, City University of Hong Kong Laser-induced Graphene for Rapid and Efficient Disinfections |
| 12:00 - 12:30 | Invited Speaker
Dr. Yingxia Liu, City University of Hong Kong The Design of Copper Microstructure for the Fast Killing of Virus |
| 12:30 - 14:00 | Lunch Break |
| 14:00 - 14:50 | Keynote Speaker
Dr. Douglas Yu, Taiwan Semiconductor Manufacturing Company (TSMC) Implementation of Advanced Materials for Semiconductor Technologies |
| 14:50 - 15:20 | Invited Speaker
Prof. Chih Chen, National Yang Ming Chiao Tung University Cu-to-Cu Direct Bonding and Hybrid Bonding |
| 15:20 - 15:50 | Invited Speaker
Prof. Yi-Chia Chou, National Taiwan University Point Contact Reaction for Silicide Formation in Si Nanowires |
| 15:50 - 16:20 | Break |
| 16:20 - 16:50 | Invited Speaker
Prof. Andriy M. Gusak, Cherkasy National University New Thermodynamic Approaches to Failure Analysis in Microelectronic Materials |
| 16:50 - 17:20 | Invited Speaker
Prof. Xinping Qu, Fudan University Wet Processes Deposition for HAR TSV Metallization using Electroless Co Liner and Alkaline Cu Seed Layer |
| 17:20 - 17:50 | Invited Speaker
Prof. King-Ning Tu, City University of Hong Kong Low Entropy Electronic Packaging Centre in City U, HK |
| Day 2: 20 September 2022 (Tuesday) | |
|---|---|
| 09:00 - 09:50 | Keynote Speaker
Prof. Zhaoping Lu, University of Science and Technology Beijing Developing Advanced High-Performance Metallic Materials via Engineering Coherent Nanostructures |
| 09:50 - 10:20 | Invited Speaker
Prof. Peter K. Liaw, The University of Tennessee Advanced High-entropy Alloys Design and Fundamental Understanding Aided by Neutron Scattering |
| 10:20 - 10:50 | Break |
| 10:50 - 11:20 | Invited Speaker
Prof. Yong Liu, Central South University Design and Strengthening Mechanism of Ti Metal-Metal Composite (MMC) with Heterogeneous Structures |
| 11:20 - 11:50 | Invited Speaker
Prof. Mingxin Huang, The University of Hong Kong Revisit TWIP and TRIP Effects on Strain Hardening of High-strength Steels |
| 11:50 - 12:20 | Invited Speaker
Prof. Yong Yang, City University of Hong Kong Multi-Functional High Entropy Alloys with Heterogeneous Lattice Strain |
| 12:20 - 14:00 | Lunch Break |
| 14:00 - 14:30 | Invited Speaker
Prof. Jien-Wei Yeh, National Tsing Hua University High-entropy Materials Technology |
| 14:30 - 15:00 | Invited Speaker
Dr. Tao Yang, City University of Hong Kong Chemically Complex Intermetallic Alloys for Advanced Structural Applications |
| 15:00 - 15:30 | Break |
| 15:30 - 16:00 | Invited Speaker
Dr. Zengbao Jiao, The Hong Kong Polytechnic University Ultrastrong and Ductile High-entropy Alloys with Coherent Nano-lamellar Architectures |
| 16:00 - 16:50 | Keynote Speaker
Prof. Dierk Raabe, Max Planck-Institut für Eisenforschung How to Make High Strength Aluminium Alloys Resistant to Hydrogen Embrittlement |
| 16:50 - 17:00 | Break |
| 17:00 - 17:45 | Short Talk Speakers
Dr. M. Naeem, Dr. Shijun Zhao & Dr. Zhaoxun Wu, City University of Hong Kong |