STURDY is mainly engaged in the independent R&D and production of packaging materials in the semiconductor industry, and strives to break the monopoly and technological blockade of foreign companies in this field. At present, many products have been recognized by the market.
Sturdy New Materials Science and Technology (Shenzhen) Ltd. Co. was founded in September 2020. It is engaged mainly in the R&D and production of conductive silver adhesive, which is widely used in IC and LED packaging in the semiconductor industry as a kind of die-attach glue. So far, we have two silver adhesive products, which have passed multiple rounds of testing and verification by benchmark customers in the industry, basically reaching the quality standards and performance indicators of international first-line brands. This has laid a solid foundation for the next step of large-scale mass production and domestic substitution. Our conductive silver glue has the characteristics of high electrical conductivity, high adhesion, high temperature resistance, high thermal conductivity and strong reliability.
Dr He Kangqiang (Alumnus, Dept. of Materials Science and Engineering, CityU)
Dr Du Peng (Alumnus, Dept. of Materials Science and Engineering, CityU)
Mr Huang Zhonghan (Graduate, Guangdong University of Technology)
Mr Zhong Wuwen (Graduate, Anhui Jianzhu University)
Dr Liu Chen (Alumnus, Dept. of Materials Science and Engineering, CityU)
Mr Luo Huahui (Alumnus, College of Business, CityU)
(Info based on the company's application form)
- CityU HK Tech 300 Angel Fund (2021)
- CityU HK Tech 300 Seed Fund (2021)
- 深創賽龍崗區新材料賽道團隊組 一等獎（2021）
- 深創賽市決賽新材料賽道團隊組 優秀獎（2021）
- 創匯香湘創業比賽 二等獎（2021）
- 深圳市龍崗區＂東進杯＂大學生創新創業比賽 三等獎（2020）