"Fundamentals of Advanced Packaging" is a comprehensive course designed to equip students with the essential knowledge and skills in the field of advanced packaging technology. As electronic devices continue to shrink in size while increasing in functionality, advanced packaging plays a crucial role in enabling this trend. This course offers a deep insight into the principles, techniques, and technologies involved in advanced packaging, covering topics such as 3D integration, heterogeneous integration, system-in-package (SiP), and advanced interconnection methods. Students will learn about the latest advancements in packaging materials, processes, and designs, as well as the challenges and opportunities in this rapidly evolving field. Through a combination of lectures and case studies, students will develop a solid understanding of advanced packaging concepts and their applications in various industries, including consumer electronics, telecommunications, automotive, and healthcare. Whether you're a student pursuing a career in electronics engineering or a professional looking to expand your expertise, this course will provide you with the foundation needed to excel in the dynamic world of advanced packaging.