Dr. Liu’s primary research interest is in the technology and reliability study of 3D integration circuit (3D IC) technologies. The 3D vertical integration is achieved by the interconnect technology of microbumps and through-silicon vias, and in the future, by direct interconnect bonding. The 3D IC technology is compatible with nowadays Si chip technology and is one of the most promising ways to sustain current computational trends. In addition to the performance improvement of consumer electronic products, 3D integration can bring very different new technologies together.
By developing ultra-high-density interconnect technology in 3D integration, Dr. Liu is trying to achieve high-density photonic device integration and carbon nanotube field effect transistor integration with current Si-based logic processors. Her recent research also extends to the 3D integration technology and system engineering for superconducting qubits.
In addition to the development of interconnect technology, Dr. Liu also focuses on the reliability science of interconnects in chip and packaging technology, including the flux-driving kinetics in the interconnects, Joule heating and heat dissipation, and thermal stress analysis and mitigation.
Education:
2012 BS in Chemistry, Peking University, China
2016 PhD in Material Science and Engineering, UCLA, USA.
Previous Experience
- Sep 2018 - Oct 2021, Associate Professor, Beijing Institute of Technology, Beijing, China. Research in the development of low-melting-point solder for advanced packaging technology.
- Nov 2016 - Aug 2018, Quality and Reliability R & D Engineer, Intel, San Jose, USA . Research in the reliability studies of Intel’s 2.5D IC packaging technology, EMIB (Embedded Multi-Die Interconnect Bridge).
Journal
- Liu, Y*. , Pu, L. , Yang, Y*. , He, Q. , Zhou, Z. , Tan, C. , Zhao, X. , Zhang, Q. & Tu, K. N. (2020). A high entropy alloy as very low melting point solder for advanced electronic packaging. Materials Today Advances. 7. 100101 .
- Wu, R. , Zhao, X. & Liu, Y*. (2020). Atomic insights of Cu nanoparticles melting and sintering behavior in Cu-Cu direct bonding. Materials & Design. 197. 109204 .
- Pu, L. , Liu, Y*. , Yang, Y. , He, Q. , Zhou, Z. , Zhao, X. , Tan, C. & Tu, K. N. (2020). Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation. Materials Letters. 127891 .
- Liu, Y*. & Tu, K. N. (2020). Low melting point solders based on Sn, Bi, and In elements. Materials Today Advances. 8. 100115 .
- Liu, Y*. , Shi, X. , Ren, H. , Cai, J. , Zhao, X. , Tan, C. & Tu, K. N. (2020). Surface diffusion controlled reaction in small size microbumps. Materials Letters. 284. 129036 .
- Liu, Y*. , Pu, L. , Gusak, A. , Zhao, X. , Tan, C. & Tu, K. N. (2020). Ultra-thin intermetallic compound formation in micro-bump technology by the control of interfacial reaction kinetics between SnBiInZn solder and Cu. Materialia. 100791 .
- Tu, K. N*. & Liu, Y. (2019). Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology. Materials Science and Engineering: R: Reports. 136. 1 - 12.
- Tu, K. N*. , Liu, Y. & Li, M. (2017). Effect of Joule heating and current crowding on electromigration in mobile technology. Applied Physics Reviews. 4. 011101 .
- Liu, Y. , Chen, Y. T. , Gu, S. , Kim, D. W. & Tu, K. N*. (2016). Fracture reliability concern of (Au,Ni)Sn4 phase in 3D integrated circuit microbumps using Ni/Au surface finishing. Scripta Materialia. 119. 9 - 12.
- Liu, Y. , Chu, Y. C. & Tu, K. N*. (2016). Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 μm diameter. Acta Materialia. 117. 146 - 152.
- Liu, Y. , Tamura, N. , Kim, D. W. , Gu, S. & Tu, K. N*. (2015). A metastable phase of tin in 3D integrated circuit solder microbumps. Scripta Materialia. 102. 39 - 42.
- Liu, Y. , Li, M. , Kim, D. W. , Gu, S. & Tu, K. N*. (2015). Synergistic effect of electromigration and Joule heating on system level weak-link failure in 2.5 D integrated circuits. Journal of Applied Physics. 118. 135304 .
Last update date :
05 Jul 2022
