Packaging for Nanoelectronics is an advanced course that focuses on specialized packaging technologies for nanoelectronic devices. It covers the challenges, requirements, and advancements in nanoscale packaging, including system integration, interconnects, and management. The course explores various topics such as design considerations, advanced materials, and interconnect technologies. It also delves into the reliability aspects of nanoelectronic packaging, addressing concerns such as electromigration, thermal cycling, and mechanical stress. Real-world case studies and examples are incorporated to provide practical insights and enhance understanding. The course highlights emerging trends and future directions in nanoelectronics packaging. By the end of the course, students will possess the skills necessary to design, analyze, and optimize packaging solutions for nanoelectronic devices, considering the unique challenges and requirements at the nanoscale.

Continuous Assessment: 50%

Examination: 50%

Examination Duration: 2 hours