Learn the use and science fundamentals behind the materials critical to microelectronic devices and device packaging, such as silicon, germanium, alumina, silver, copper and polymers. This course includes conventional and state-of-the-art fabrication techniques. Highlighted within the course will be the processing unit operations in semiconductor manufacturing (e.g., PVD, CVD, CMP, Electroplating, Etching, Photolithography, Ion Implantation), testing/assembly of these materials as semiconductor devices, and the protective packaging that permits these microdevices to be interconnected within larger electronic systems. At course completion, students will possess an understanding of each processing unit in semiconductor manufacturing, packaging and assembly, and materials integration of microelectronic devices.

Continuous Assessment: 50%

Examination: 50%

Examination Duration: 2 hours